Discover Ultrasonic Innovation at Anuga FoodTec 2024 with SinapTec
Join us at Anuga FoodTec 2024, the first international trade fair for food technology, and experience the forefront of innovation in the food industry.
As a major participant, SinapTec cordially invites you to visit us from 19th to 22nd March, in Hall 10.1, Booth D087 in Cologne!
Discover how our ultrasonic OEM solutions are transforming food processing and packaging, while helping equipment manufacturers reduce energy consumption and improve efficiency, quality and sustainability.
Our OEM Ultrasonic Modules for Your Success
Cleaning with ultrasonic offers maximum efficiency for cleaning food production equipment, ensuring optimum hygiene and superior product quality.
Precise and clean cutting with ultrasonics enables uniform slicing of food products, providing an ideal solution for high volume production.
Ultrasonic welding technology ensures reliable sealing of food packaging, guaranteeing freshness and product safety.
Defoaming for Bottling and Canning Packaging Lines
Our ultrasonic defoaming technology is particularly suitable for bottle and can filling lines in the beverage, brewery, dairy and chemical industries. It ensures smooth and efficient production, increases filling line speed and productivity, and saves energy costs. Additionally, it reduces CO2 Consumption and so on.
Degassing:
Our ultrasonic degassing modules effectively removes air bubbles from liquids, thereby enhancing the product taste and quality.
Sieving:
Improve powder filtration and increase yield with our high-performance ultrasonic vibrator.
Visit Us at Anuga FoodTec 2024!
We look forward to meeting you in Cologne! In the meantime, we invite you to explore our ultrasonic solutions for food industry.
